Invited Talk, “Using Microfluidic Electroless Deposition Process for Low-Temperature, Pressureless Interconnection Bonding,” presented at The 30th Topical Meeting of the International Society of Electrochemistry, Taipei, November 21-24, 2021.
Invited Talk, “Microfluidic Electroless Interconnection (MELI) Process for Low-Temperature, Pressureless Chip-stacking Applications,” presented at The 236th Electrochemical Society Meeting, Atlanta, October 13-17, 2019.
Invited Talk, “Enhancement of Nano-Silver Chip Attachment by Using Transient Liquid Phase Reaction with Indium,” presented at The 20th International Conference on Electronic Packaging Technology, Hong Kong, August, 11-15, 2019.
Invited Talk, “Enhancement of Nano-Silver Chip Attachment by Using Transient Liquid Phase Reaction with Indium,” presented at International Conference on Electronic Packaging, Niigata, Japan, April 17-20, 2019.
Invited Talk, “Microfluidic Electroless Interconnection Process for Low-Temperature, Pressureless Chip-stacking,” presented at The 20th Electronics Packaging Technology Conference, Singapore, December 4-7, 2018.
Invited Talk, “Microfluidic Electroless Interconnection Process for Low-Temperature, Pressureless Chip-stacking " presented at The 20th International Conference on Electronics Materials and Packaging, Hong Kong, December 17-20, 2018.
Keynote Speaker, “Bonding Cu pillars by using the Microfluidic ElectroLess Interconnection (MELI) process,” presented at the 16th International Symposium on Microelectronics and Packaging, Seoul, Korea, October 17-19, 2017.
Invited Talk, “Bonding Cu Plillars by Using Electroless Plating,” presented at the "13th TMS Workshop on Emerging Electronic Interconnect Materials and Processing for Advanced Packaging Technology" during The Minerals, Metals & Materials Society 2017 Annual Meeting, San Diego, CA, February 26-March 2, 2017.
Invited Talk, “Low-temperature and pressureless Cu-to-Cu bonding by electroless nickel plating,” presented at the "Frontiers in Materials Science, Engineering, and Technology Symposium" during The Minerals, Metals & Materials Society 2017 Annual Meeting, San Diego, CA, February 26-March 2, 2017.
Invited Talk, “Mechanical Properties of Intermetallics in Solder Joints,” presented at International Conference on Electronic Packaging, Sapporo, Japan, April 20-22, 2016.
Invited Talk, “Micromechanical Behaviors of Intermetallic Compounds for Structural Applications in Micro Joints,” presented at the International Workshop on Advanced Materials 2016, Yangzhou, China, March 27-31, 2016.
Invited Talk, “Interfacial Reactions with Low Solder Volumes,” presented at Materials Science & Technology 2015 Conference, Columbus, OH, October 4-8, 2015.
Invited Talk, “Mechanical Properties of Intermetallics in Solder Joints,” presented at the 14th International Symposium on Microelectronics and Packaging, Seoul/llsan, Korea, October 13-15, 2015.
Invited Talk, “Interfacial Reactions rising from Low Solder Volume in 3D IC Packaging,” presented at International Conference on Electronic Packaging and iMAPS All Asia Conference, Kyoto, Japan, April 14-17, 2015.
Keynote Speaker, “Critical New Issues Relating to Interfacial Reactions Arising from Low Solder Volume in 3D IC Packaging,” presented at the Sixth Symposium on Nano-Technology/Materials for Future Devices, Tainan, Taiwan, September 2-5, 2014.
Plenary Speaker, “Critical New Issues Relating to Interfacial Reactions Arising from Low Solder Volume in 3D IC Packaging,” presented at the International Conference on the Science and Engineering of Materials 2013, Kuala Lumpur, Malaysia, November 13-14, 2013.
Invited Talk, “Interfacial Reactions of Micro Joints for Chip Stacking Applications,” presented at 15th International Conference on Electronic Materials and Packaging, Seoul, Korea, October 6-9, 2013.
Invited Talk, “New Issues Relating to Interfacial Reactions Arising from Low Solder Volume in 3D IC Packaging,” presented at 8th Pacific Rim International Congress of Advanced Materials and Processing, Waikoloa, Hawaii, August 4-9, 2013.
Invited Talk, “Critical New Issues Relating to Interfacial Reactions Arising from Low Solder Volume in 3D IC Packaging,” presented at Materials Science & Technology 2012 Conference, Pittsburgh, PA, October 7-11, 2012.
Invited Talk, “Critical New Issues Relating to Interfacial Reactions Arising from Low Solder Volume in 3D IC Packaging,” presented at the 2012 International Symposium on Materials for Enabling Nanodevices, California Nano-System Institute, Los Angeles, CA, August 27-29, 2012.
Session Co-Chair for “Bonding Materials and Processes” session, at The 62nd Electronic Components and Technology Conference, San Diego, CA, May 29- June 1, 2012.
Seminar, “Critical Materials Interaction Issues Relating to Intermetallic Formation for 3D IC Applications,” IBM T. J. Watson Research Center, Yorktown Heights, October 13, 2011.
Invited Talk, “Critical Issues Relating to Intermetallic Formation in 3D ICs,” presented at The 8th International Workshop on Advanced Intermetallic and Metallic Materials, Changsha, China, May 10-13, 2011.
Invited Talk, “On the driving force for massive spalling in solder systems,” presented at the "Pb-Free Solders and Other Materials for Emerging Interconnect and Packaging Technologies" during The Minerals, Metals & Materials Society 2011 Annual Meeting, San Diego, CA, February 27-March 3, 2011.
Invited Talk, “Applications of Equilibrium Phase Diagrams to Solving Materials Interactions Problems in Electronic Interconnects,” presented at Materials Science & Technology 2010 Conference, Houston, TX, October 17-21, 2010.
Session Chair for the symposium: “Phase Stability, Diffusion, Kinetics and Their Applications (PSDK-V),” at Materials Science & Technology 2010 Conference, Houston, TX, October 17-21, 2010.
Invited Talk, “Massive spalling in multi-component systems: from an unproven theory to confirmed mechanism,” presented at the 2010 International Symposium on Materials for Enabling Nanodevices, Los Angeles, CA, September 8-10, 2010.
Invited Panelist, “6th TMS Lead-free Solder and Technology Workshop”, during The Minerals, Metals & Materials Society 2010 Annual Meeting, Seattle, WA, February 14-18, 2010.
Invited Panelist, “Lead-free Solder Workshop”, during The Minerals, Metals & Materials Society 2009 Annual Meeting, San Francisco, CA, February 15-19, 2009.
Keynote, "Development of Lead-Free Solders with Superior Drop Test Reliability Performance," presented at 2009 International Conference on Electronic Packaging Technology and High Density Packaging, Beijing, August 10-13, 2009.
Invited Talk, “Kirkendall Void Formation in the Reaction Between Cu Substrate and Lead-Free Solder,” presented at Materials Science & Technology 2008 Conference, Pittsburgh, PA, October 5-9, 2008.
Session Chair for the symposium: “Pb-Free, Pb-Bearing Joining and Packaging Materials and Processes for Microelectronics,” at Materials Science & Technology 2008 Conference, Pittsburgh, PA, October 5-9, 2008.
Invited Talk, “Metal Phase Formation and Interaction in Electronic Packaging,” presented at the “Electronic Packaging Materials Symposium,” at MRS International Materials Research Conference, Chongqing, China, June 9 – 12, 2008.
Session Chair for the symposium: “Electronic Packaging Materials,” at MRS International Materials Research Conference, Chongqing, China, June 9 – 12, 2008.
Invited Panelist, “State of Art Lead-free Technology Workshop”, during The Minerals, Metals & Materials Society 2008 Annual Meeting, New Orleans, LA, March 9-13, 2008.
Invited Talk, “Pronounced Electromigration of Cu in Molten Sn-based Solders,” presented at the "Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials VII Symposium" during The Minerals, Metals & Materials Society 2008 Annual Meeting, New Orleans, LA, March 9-13, 2008.
Invited Talk, “Metal Phase Formation and Interaction in Electronic Packaging,” presented at the "Hume-Rothery Symposium: Nanoscale Phases" during The Minerals, Metals & Materials Society 2008 Annual Meeting, New Orleans, LA, March 9-13, 2008.
Session Chair for the symposium: “Emerging Interconnect and Packaging Technologies,” at The Minerals, Metals & Materials Society 2008 Annual Meeting, New Orleans, LA, March 9-13, 2008.
Invited Talk, "Critical Materials Problems in Advanced Electronic Packages," 2007新材料發展趨勢研討會, 廈門, December 15-16, 2007.
Invited Talk, “Massive Spalling of Intermetallic Compound in Solder Joints,” presented at the "Lead-Free Solders: Emerging Issues in Manufacturing, Performance and Reliability Symposium" during Materials Science & Technology 2007 Conference, Detroit, MI, September 16-20, 2007.
Invited Talk, “Application of Phase Diagrams to the Study of Interfacial Reactions in Electronic Solder Joints,” presented at the Symposium on Phase Stability and Defect Structures in Advanced Materials: in honoring Professor Austin Chang, Distinguished Professor at University of Wisconsin, Crown Plaza Orlando Resort, Orlando, FL, February 28 – March 2, 2007.
Invited Talk, “Interfacial Reactions in Lead-Free Electronic Solder Joints,” presented at The Minerals, Metals & Materials Society 2007 Annual Meeting, Orlando, FL, February 25 – March 1, 2007.
Session Chair for the symposium: “Pb-Free Electronic Solders: Alloy Design, Characterization and Service Reliability,” at The Minerals, Metals & Materials Society 2007 Annual Meeting, Orlando, FL, February 25 – March 1, 2007.
Invited Talk, “Massive spalling of intermetallic compound in lead-free solder joints,” presented at the Advanced Electronic Packaging Symposium, Materials Research Society Fall Meeting, Boston, MA, November 27 – December 1, 2006.
Invited Talk, “Effect of Zn addition on the interfacial reactions between Cu and lead-free solders,” presented at the Advanced Electronic Packaging Symposium, Materials Research Society Fall Meeting, Boston, MA, November 27 – December 1, 2006.
Session Chair for the symposium: “Advanced Electronic Packaging Symposium,” at Materials Research Society Fall Meeting, Boston, MA, November 27 – December 1, 2006.
Discussion Leader, Gordon Research Conference on High Temperature Materials, Colby College, Maine, July 16-21, 2006.
Invited Talk, “The Cross-Interaction Between Cu and Ni in Lead-Free Solder Joints,” presented at the Lead-Free Technology Workshop, The Minerals, Metals & Materials Society 2006 Annual Meeting, San Antonio, TX, March 12-16, 2006.
Session Chair for the symposium: “Phase Stability, Phase Transformations & Reactive Phase Formation in Electronic Materials V,” at The Minerals, Metals & Materials Society 2006 Annual Meeting, San Antonio, TX, March 12-16, 2006.
Session Chair for the symposium: “Lead- Free Solder Implementation: Reliability, Alloy Development, and New Technology,” at The Minerals, Metals & Materials Society 2006 Annual Meeting, San Antonio, TX, March 12-16, 2006.
Seminar, “Three Interesting Materials Interaction Problems in Advanced Electronic Packages,” presented at The Intel Technology Forum, a worldwide seminar series (broadcasted over worldwide Intel sites), December 2, 2005.
Session Chair for the symposium: “Current Topic in Electronic Packaging: Pb-Free Solders, Thermal Management,” at Materials Science & Technology 2005 Conference, Pittsburgh, PA, September 25-28, 2005.
Session Chair for the symposium: “10th International Symposium and Exhibition on Advanced Packaging Materials: Processes, Properties and Interface,” IEEE, Irvine, CA (Beckman Center of the National Academies in Irvine), March 16-18, 2005.
Session Chair for the symposium: “Phase Stability, Phase Transformations & Reactive Phase Formation in Electronic Materials IV,” at The Minerals, Metals & Materials Society 2005 Annual Meeting, San Francisco, CA, February 13-17, 2005.
Seminar, “Three Interesting Materials Problems in Advanced Electronic Packages,” College of Materials Science & Engineering, Beijing University of Technology, November 4, 2004.
Session Chair for the symposium: “Lead-Free and Lead-Bearing Solders,” at Materials Science & Technology 2004, New Orleans, LA, September 26-30, 2004.
Session Chair for the symposium: “Lead-Free Solders and Processing Issues Relevant to Microelectronic Packaging,” at The Minerals, Metals & Materials Society 2004 Annual Meeting, Charlotte, NC, March 14-18, 2004.
Session Chair for the symposium: “Phase Stability, Phase Transformations & Reactive Phase Formation in Electronic Materials III,” at The Minerals, Metals & Materials Society 2004 Annual Meeting, Charlotte, NC, March 14-18, 2004.
Session Chair for the symposium: “Lead-Free and Lead-Bearing Solders,” at Materials Science & Technology 2003, Chicago, IL, November 9-12, 2003.
Invited Talk, “Solid-State Aging Reactions Between Ni and SnCu Lead-Free Solders with Different Cu Concentrations,” presented at The Minerals, Metals & Materials Society 2003 Annual Meeting, San Diego, CA, March 2-6, 2003.
Session Chair for the symposium: “Phase Stability, Phase Transformations & Reactive Phase Formation in Electronic Materials,” at The Minerals, Metals & Materials Society 2003 Annual Meeting, San Diego, CA, March 2-6, 2003.
Session Chair for the symposium: “Lead-Free Solders and Processing Issues Relevant to Microelectronic Packaging: Microstructural Characterization and Evolution,” at The Minerals, Metals & Materials Society 2003 Annual Meeting, San Diego, CA, March 2-6, 2003.
Seminar, “Three Interesting Metallurgical Problems in Advanced Electronic Packages,” Materials Science Program, State University of New York, Binghamton, N.Y., November 22, 2002.
Session Chair for the symposium: “Lead-Free and Lead-Bearing Solders,” at The Minerals, Metals & Materials Society 2002 Fall Meeting, Columbus, OH, October 6-10, 2002.
Invited Talk, “Effect of Cu Concentration on the Solid-State Aging Reactions between SnCu Lead-Free Solders and Ni,” presented at The SMTA International Technical Conference, Rosemont, IL, September 22-26, 2002.
Session Chair for the workshop: “Pb-Free Solder for Electronic, Optical, and MEMS Packaging Manufacturing,” University of California at Los Angeles, Los Angeles, CA, September 5-6, 2002.
Session Chair for the symposium: “Lead-Free Solders and Materials Issues in Microelectronic Packaging,” at The Minerals, Metals & Materials Society 2002 Annual Meeting, Seattle, WA, February 17-21, 2002.
Invited Talk, “A Study on Applying the Sn-3.9Ag-0.6Cu Solder to Electronic Packages with Ni Metallization,” presented at The Minerals, Metals & Materials Society 2002 Annual Meeting, Seattle, WA, February 17-21, 2002.
Session Chair for the symposium: “Phase Stability, Phase Transformations & Reactive Phase Formation in Electronic Materials,” at The Minerals, Metals & Materials Society 2002 Annual Meeting, Seattle, WA, February 17-21, 2002.
Invited Talk, “Strong Effect of Cu Concentration on the Reactions Between SnAgCu Lead-Free Solders and Ni,” presented at The Minerals, Metals & Materials Society 2002 Annual Meeting, Seattle, WA, February 17-21, 2002.
Session Chair for the symposium: “Lead-Free, Lead-Bearing Solders and Alternative Surface Finishes for Electronic Packaging,” at The Minerals, Metals & Materials Society 2001 Fall Meeting, Indianapolis, IN, November 4-8, 2001.
Session Chair for the symposium: “Lead-Free Solder Materials and Soldering Technology,” at The Minerals, Metals & Materials Society 2001 Annual Meeting, New Orleans, LA, February 11-15, 2001.
Invited Talk, “Reactions of Eutectic BiSn Solder with Au/Ni Surface Finish,” presented at The Minerals, Metals & Materials Society 2001 Annual Meeting, New Orleans, LA, February 11-15, 2001.
Invited Talk, “Applications of Thermodynamics in the Study of Interfacial Reactions in Microelectronic Package,” presented at The Minerals, Metals & Materials Society 2000 Fall Meeting, St. Louis, MO, October 8-12, 2000.
Invited Talk, “Solid-Solid Reactions and Solid-Liquid Reactions of the Same Material System: A Comparative Study,” presented at the Gordon Research Conference on High Temperature Materials, Processes, and Diagnostics, Plymouth State College, Plymouth, NH, July 23-28, 2000.
Invited Talk, “Formation and migration of AuSn4 in BGA solder joints with the Au/Ni surface finish,” presented at The Minerals, Metals & Materials Society 2000 Annual Meeting, Nashville, TN, March 11-17, 2000.
Session Chair for the Symposium: “Environmental and Chemical Degradation of Materials,” at The Minerals, Metals & Materials Society 1999 Fall Meeting, Cincinnati, OH, October 31–November 4, 1999.
Invited Talk, “Processing of in-situ composites for high-temperature structural application,” presented at the 1997 International Conference on Thermomechanical Processing of Steel & Other Materials, Australia, July 7-11, 1997.
Invited Talk, “In-situ composite synthesis of metal silicide reinforced with silicon carbide via solid state displacement reactions,” presented at The Minerals, Metals & Materials Society 1996 Annual Meeting, Anaheim, CA, Feb. 4-8, 1996.
Invited Talk, “Reactive diffusion between silicon and niobium carbide,” presented at The Minerals, Metals & Materials Society 1995 Fall Meeting, Cleveland, OH, Oct. 29 - Nov. 2, 1995.
Invited Talk, “The distribution of substitutional solutes between the two sublattices in triple-defect B2 intermetallic compounds,” presented at The Minerals, Metals & Materials Society 1995 Fall Meeting, Cleveland, OH, Oct. 29 - Nov. 2, 1995.
“2017 Taiwan-Japan Workshop on Electronic Interconnection I,” National Taiwan University, October 24, 2017. Organizer: C. Robert Kao.
“Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology,” The Minerals, Metals & Materials Society 2017 Annual Meeting, San Diego, CA, February 26-March 2, 2017. Organizer: Fan-Yi Ouyang, C. Robert Kao, Albert T Wu, Fay Hua, Yan Li, Babak Arfaei, Kazuhiro Nogita.
“Pb-free Solders and Emerging Interconnect and Packaging Materials,” The Minerals, Metals & Materials Society 2014 Annual Meeting, San Diego, CA, February 16-20, 2014. Organizer: Andre Lee, Fay Hua, Tae-Kyu Lee, John Elmer, Yan Li, C. Robert Kao, Fan-yi Ouyang, Chang-Woo Lee, Won Sik Hong, Heugel Werner.
“Materials and Processes for Advanced Interconnects and Packaging Technologies,” International Union of Materials Research Societies – International Conference on Electronic Materials, Taipei, June 10-14, 2014. Organizer: A. T. Wu, C. M. Chen, C. R. Kao, C. E. Ho, J. G Duh. J. M. Song, K. L. Lin, S. K. Lin, and W. P. Dow.
“Phase Stability, Diffusion, Kinetics and Their Applications V,” Materials Science & Technology 2010 Conference, Houston, TX, October 17-21, 2010, Organizer: John Morral (Ohio State University), Raymundo Arroyave (Texas A & M University), Yongho Sohn (University of Central Florida), Sudarsanam Babu (Ohio State University), C. Robert Kao (National Taiwan University), and Jingxian Zhang (Carpenter Technology).
“Pb-Free, Pb-Bearing Joining and Packaging Materials and Processes for Microelectronics,” Materials Science & Technology 2009 Conference, Pittsburgh, PA, October 25-29, 2009. Organizer: Andre Lee (Michigan State University) and C. R. Kao (National Taiwan University).
“Electronic, Magnetic and Photonic Materials Division Symposium: Advanced Metallizations and Interconnect Technologies, in Honor of Prof. K. N. Tu’s 70th Birthday,” The Minerals, Metals & Materials Society 2007 Annual Meeting, Orlando, FL, February 25 – March 1, 2007. Organizer: C. Chen (National Chiao Tung University), L. J. Chen (National Tsing Hua University), Ulrich Goesele (Max Planck Institute of Microstructure Physics), C. R. Kao (National Central University), and S. W. Chen (Tsing-Hua University).
“Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials V Symposium,” The Minerals, Metals & Materials Society 2006 Annual Meeting, San Antonio, TX, March 12-16, 2006. Organizer: K. Suganuma (Osaka University), D. Swenson (Michigan Tech. Univ.), S. Chada (Jabil Circuit), S. W. Chen (Tsing-Hua University), C. R. Kao (National Central University), , H. M. Lee (KAIST), and S. E. Mohney (Pennsylvania State University).
“Current Topic in Electronic Packaging: Pb-Free Solders, Thermal Management Symposium,” Materials Science & Technology 2005 Conference, Pittsburgh, PA, September 25-28, 2005. Organizer: Eric J. Cotts (SUNY – Binghamton), C. R. Kao (National Central University), Mark A. Palmer (Kettring University), K. N. Subramanian (Michigan State University), Paul T. Vianco (Sandia National Laboratories), and K. M. Nair.
“Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials IV Symposium,” The Minerals, Metals & Materials Society 2005 Annual Meeting, San Francisco, CA, February 13-17, 2005. Organizer: D. Swenson (Michigan Tech. Univ.), S. Chada (Jabil Circuit), S. W. Chen (Tsing-Hua University), C. R. Kao (National Central University), H. M. Lee (KAIST), S. E. Mohney (Pennsylvania State University), and K. Suganuma (Osaka University).
“Lead-Free and Lead-Bearing Solders Symposium,” Materials Science & Technology 2004 Conference, New Orleans, LA, September 26-30, 2004. Organizer: C. R. Kao (National Central University), K. N. Subramanian (Michigan State University), and W. Plumbridge (Open University).
“Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials III Symposium,” The Minerals, Metals & Materials Society 2004 Annual Meeting, Charlotte, NC, March 14-18, 2004. Organizer: C. R. Kao (National Central University), S. W. Chen (Tsing-Hua University), H. M. Lee (KAIST), S. E. Mohney (Pennsylvania State University), M. R. Notis (Lehigh University), and D. Swenson (Michigan Tech.).
“Lead-Free and Lead-Bearing Solders Symposium,” Materials Science & Technology 2003 Conference, Chicago, IL, November 9-12, 2003. Organizer: K. N. Subramanian (Michigan State University), C. R. Kao (National Central University).
“Lead-Free Solders and Processing Issues Relevant to Microelectronics Packaging,” The Minerals, Metals & Materials Society 2003 Annual Meeting, San Diego, CA, March 2-6, 2003. Organizer: James P. Lucas (Michigan State University), Srinivas Chada (Motorola), Sung K. Kang (IBM), Kwang-Lung Lin, (National Cheng Kung University), Jin Yu (KAIST), C. Robert Kao (National Central University).
“Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials Symposium,” The Minerals, Metals & Materials Society 2003 Annual Meeting, San Diego, CA, March 2-6, 2003. Organizer: S. W. Chen (Tsing-Hua University), C. R. Kao (National Central University), H. M. Lee (KAIST), S. E. Mohney (Pennsylvania State University), M. R. Notis (Lehigh University), and D. Swenson (Michigan Tech.).
“Lead-Free and Lead-Bearing Solders Symposium,” The Minerals, Metals & Materials Society 2002 Fall Meeting, Columbus, OH, October 6-10, 2002. Organizer: K. N. Subramanian (Michigan State University), C. R. Kao (National Central University), and M. Pfeifer (Motorola).
“Lead-Free Solders and Materials Issues in Microelectronic Packaging Symposium,” The Minerals, Metals & Materials Society 2002 Annual Meeting, Seattle, WA, February 17-21, 2002. Organizer: S. Chada (Motorola), D. Frear (Motorola), J. Sungho (Lucent), S. K. Kang (IBM), C. R. Kao (National Central University), M. Pfeifer (Motorola), and M. Weiser, (Honeywell Electronics Materials).
“Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials Symposium,” The Minerals, Metals & Materials Society 2002 Annual Meeting, Seattle, WA, February 17-21, 2002. Organizer: S. W. Chen (Tsing-Hua University), M. R. Notis (Lehigh University), H. M. Lee (KAIST), D. Swenson (Michigan Tech.), and C. R. Kao (National Central University).
“Lead-Free, Lead-Bearing Solders and Alternative Surface Finishes for Electronic Packaging Symposium,” The Minerals, Metals & Materials Society 2001 Fall Meeting, Indianapolis, IN, November 4-8, 2001. Organizer: C. R. Kao (National Central University), S. Chada (Motorola), Z. Mei, (Fujitsu), G. Ghosh (Northwestern), S. W. Chen (Tsing-Hua University), and P. S. Godavarti (FlipChip Technologies).
“Lead-Free Solder Materials and Soldering Technologies Symposium,” The Minerals, Metals & Materials Society 2001 Annual Meeting, New Orleans, LA, February 11-15, 2001. Organizer: S. K. Kang (IBM), H. Mavoori (Lucent Technologies), S. Chada (Motorola), C. R. Kao (National Central University), and R. W. Smith (Materials Resources International).
2014
2010
2009
2007
2006
2005
2004
2003
2002
2001
International Advisory Committee, 3rd International Conference on the Science and Engineering of Materials, Kuala Lumpur, Malaysia, October 24–25, 2017.
International Advisory Panel, 10th International Materials Technology Conference & Exhibition, Kuala Lumpur, Malaysia, May 16–19, 2016.
International Advisory Board, 14th International Symposium on Microelectronics and Packaging, Seoul, October 13-15, 2015.
International Advisory Committee, 2nd International Conference on the Science and Engineering of Materials, Kuala Lumpur, November 16-18, 2015.
Technical Committee, 16th Electronics Packaging Technology Conference, Singapore, December 3-5, 2014.
International Advisory Board, IUMRS-International Conference on Electronic Materials, Taipei, June 10-14, 2014.
International Advisory Committee, 15th International Conference on Electronic Materials and Packaging, Seoul/Ilsan, October 6-9, 2013.
Technical Program Committee, “15th IEEE International Symposium and Exhibition on Advanced Packaging Materials,” Irvine, CA, February 27 – March 1, 2013.
International Advisory Board, 14th International Conference on Electronic Materials and Packaging, Hong Kong, December 13-16, 2012.
Program Committee, 2011 IUMRS-ICA Conference, Taipei, September 19-23, 2011.
International Advisory Board, "34th International Electronics Manufacturing Technology Conference," Melaka, Malaysia, November 30-December 2, 2010.
Technical Program Committee, "The International Microsystems, Packaging, Assembly and Circuits Technology Conference," Taipei, October 20-22, 2010.
Technical Program Committee, "The Forth International Microsystems, Packaging, Assembly and Circuits Technology Conference," Taipei, October 21-24, 2009.
Technical Program Committee, "International Microsystems, Packaging, Assembly and Circuits Technology Conference," Taipei, October 22-24, 2008.
Advisory Committee, “International Microsystems, Packaging, Assembly and Circuits Technology Conference,” Taipei, October 1-3, 2007.
Conference Grid Chair, “The Minerals, Metals & Materials Society 2006 Annual Meeting,” San Antonio, TX, March 12-16, 2006.
International Committee, “10th International Symposium and Exhibition on Advanced Packaging Materials: Processes, Properties and Interface,” IEEE, Irvine, CA (Beckman Center of the National Academies in Irvine), March 16-18, 2005.
International Liaison, “GlobalTRONICS Technology Conference 2002 on Electronics Manufacturing, Design and Display Technologies,” Singapore, September 3-6, 2002.
Organizing Committee, “The 4th International Symposium on Electronic Materials and Packaging,” Grand Formosa Hotel, Kaohsiung, IEEE, December 4-6, 2002.
Principal Editor, Journal of Materials Research, 2003-present.
Editor, Journal of Materials Science: Materials in Electronics, 2015-present.
Associate Editor, Materials Chemistry and Physics, 2010-2014.
Member of the Advisory Board, Materials Chemistry and Physics, 2016-present.
Member of the Editorial Board, International Materials Reviews, 2012-2015, 2015-present.
Member of the Editorial Committee, Journal of Phase Equilibria and Diffusion, 2007-present.
Member of the Editorial Advisory Board, Recent Patents on Materials Science, 2008-2019.
Guest editor, Journal of Electronic Materials:
September issue, 2001
January issue, 2006
November issue, 2002
November issue, 2006
November issue, 2003
December issue, 2006
December issue, 2003
December issue, 2009
October issue, 2004
Guest Editor, Microelectronics Reliability, Issue 1, issue focus “Reliability of Micro-Interconnects in 3D IC Packages,” 2013.
Guest Editor, TMS Letters, Issue 8, issue focus “General Topics in Materials Science,” 2004.
Advisor for JOM Special Topics Series on: "Lead-Free and Lead-Bearing Electronic Solders: Implementation, Reliability, and New Technology," (June, 2008). “Phase Diagrams of Important Electronic Materials,” (December, 2002). “Recent Progress in Phase Diagram Calculation and Application,” (December 2003).
Board of Governors, IEEE Components, Packaging and Manufacturing Technology Society, 2016-2018 (first term), 2019-2021 (second term).
Committee member, Impact Award Subcommittee, Materials Research Society, 2016-2018.
Committee member, New Publications Products Subcommittee, Publications Committee, Materials Research Society, 2015-2017.
Committee member, J. Willard Gibbs Award Selection Committee, American Society for Metals (ASM International), 2015-2017.
Committee member, Brimacombe Medalist, Bruce Chalmers, Morris Cohen, and Acta Materialia Gold Award Committee, The Minerals, Metals & Materials Society, 2015-2018.
中國材料學會第三十三屆、第三十四屆常務理事2012-2013, 2013-2014.
Chair, Robert Lansing Hardy Award, Application to Practice Award, Cyril Stanley Smith Award, and Alexander Scott Distinguished Service Award Committee, The Minerals, Metals & Materials Society, 2013-2014.
Committee member, Honors & Professional Recognition Committee, The Minerals, Metals & Materials Society, 2013-2014.
Committee member, William Hume-Rothery Award, Champion H. Mathewson Award, Institute of Metals Lecture/Robert Frankly Mehl Award, and Acta Materialia Gold Medal Award Subcommittee, The Minerals, Metals & Materials Society, 2010-2014.
Committee member, John Bardeen Award Committee, The Minerals, Metals & Materials Society, 2008-2010, 2010-2011 (2nd term).
Committee member, Materials and Processing Technical Committee, IEEE Components, Packaging and Manufacturing Technology Society, 2011-2014.
Committee member, International Materials Reviews Committee, American Society for Metals (ASM International), 2012-2015, 2015-2018. 2018, 2021.
Committee member, Alloy Phase Diagram Committee, American Society for Metals (ASM International), 2007-2010, 2010-2013, 2013-2016, 2016-2019.
Committee member, Technical Books Committee, American Society for Metals (ASM International), 2012-2015.
Committee member, Content Development and Dissemination Committee, The Minerals, Metals & Materials Society, 2011-2014.
Chair, Electronic Packaging and Interconnection Materials Committee, The Minerals, Metals & Materials Society, 2008-2011.
Vice Chair, Electronic Packaging and Interconnection Materials Committee, The Minerals, Metals & Materials Society, 2006-2008.
Immediate Past Chair, Electronic Packaging and Interconnection Materials Committee, The Minerals, Metals & Materials Society, 2011-2014.
Invited Committee member, MS&T 2010 and Beyond - Vision Workshop, sponsored by The American Ceramic Society, ASM International, The Minerals, Metals, and Materials Society, and Association for Iron & Steel Technology, 2006.
Committee member, Society of Nanoscience and Nanotechnology, 2006-2007.
Secretary, Electronic Packaging and Interconnection Materials Committee, The Minerals, Metals & Materials Society, 2005-2006.
理事, 國際微電子學會(IMAPS)台灣分會, 2003-present.
Council member, The Electronic, Magnetic & Photonic Materials Division, The Minerals, Metals & Materials Society, 2002-2005, 2008-2011, 2011-2013.
Committee member, Award Committee, The Electronic, Magnetic & Photonic Materials Division, The Minerals, Metals & Materials Society, 2009-2011.
Program Committee, The Minerals, Metals & Materials Society, 2003-2005.
Committee member, Membership and Student Development Committee, The Minerals, Metals & Materials Society, 2011-2014.
Committee member, Membership Development Committee, The Minerals, Metals & Materials Society, 2003-2005.
Committee member, International Activities Committee, The Minerals, Metals & Materials Society, 2002-2003.
Committee member, Electronic Packaging and Interconnection Materials Committee, The Minerals, Metals & Materials Society, 2002-present.
Committee member, Alloy Phase Committee, The Minerals, Metals & Materials Society, 1999-present.
科技部傑出特約研究員 (Merit MOST Research Fellow)，2021。
ECTC Volunteer Award, IEEE Electronics Packaging Society, 2021.
Functional Materials Division Distinguished Scientist Award, TMS (美國 礦物、金屬、材料學會), 2020。
Top 1% in Applied Physics according to standardized citation ranking by Ioannidis et al of Stanford University.
Editor’s Choice, “Foldable Kirigami Paper Electronics,” Physica Status Solidi A: Applications and Materials Science, 1900891, 2020.
科技部工程司109年度產學合作計畫成果發表暨績效考評會簡報特優獎。
Best Interactive Presentation Paper Award, 2019 IEEE Electronic Components and Technology Conference, May 28-31, 2019, Las Vegas, NV.
科技部特約研究員, 2018-2021.
Award of Excellence, Scientific Photography Competition in Photo Group, 25th Users’ Meeting &Workshops, National Synchrotron Radiation Research Center, September 17-20, 2019.
Acta Materialia and Scripta Materialia Outstanding Reviewers in 2018
Best Interactive Presentation Paper Award, 2017 IEEE Electronic Components and Technology Conference, May 30-June 2, 2017, Walt Disney Swan &Dolphin, Orlando, FL.
台灣大學特聘教授, 2017.
104年度科技部傑出研究獎, 2016。
Academician, Asia-Pacific Academic of Materials, 亞太材料科學院院士, 2015.
2014 BRIMACOMBE MEDALIST AWARD, TMS (美國 礦物、金屬、材料學會)。
Best Paper Award, 13th Electronic Circuits World Convention, Nuremberg, Germany, May 7-9, 2014.
本團隊論文 Solar Energy Materials and Solar Cells, 123, p.139, 2014, 獲再生能源知名網站 Renewable Energy Global Innovations (http://reginnovations.org/) 選為Key Scientific Article (May 24, 2014), 並專文介紹.
台灣大學特聘教授, 2014.
PCB Best Paper Award, Gold Prize, Development of Novel Modified Solid-Liquid Interdiffusion (M-SLID) Bonding Technique for 3D Chip-Stacking Applications, by T. L. Yang, T Aoki, K. Matsumoto, K. Toriyama, A. Horibe, H. Mori, Y. Orii, and C. R. Kao, 2014.
獲邀擔任 High Impact Research Icon, University of Malaya, Kuala Lumpur, 2013-2015.
論文獲選為 Journal of Applied Physics, 114, Issue 5, 2013, 之期刊封面(cover page and featured article), (053501), http://jap.aip.org/resource/1/japiau/v114/i5.
102年國科會應用型產學成果優良獎, 2013.
美國金屬學會(American Society for Metals, ASM International) 2012年會士(Fellow)。
中國材料科學學會第四屆（2012年）會士。
中國材料科學學會2012年傑出服務獎。
TMS學會之會員刊物JOM在2011年9月公佈，高振宏教授之論文(J. Electron Mater, 35, p.1017, 2006) 在該學會所出版之所有期刊中，在2006-2010間被引用次數排名前十名(第6名)。
98-100年度國科會傑出學者研究計畫主持人。
台灣大學特聘教授, 2011.
Best Paper Award, 12th Electronic Circuits World Convention, Taipei, August 9-11, 2011.
Best Paper Award, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, Beijing, August 10-13, 2009.
台灣大學特聘教授, 2008.
96年度國科會傑出研究獎。
台灣大學學術研究成果傑出獎, 2008.
依照ISI Essential Science Indicators統計，
Microelectronics Reliability, 49, p.248, 2009, (listed from 2012.5-present)
Journal of Materials Science – Materials in Electronics, 18, p.155, 2007, (listed from 2008.5-present)
Journal of Materials Research, 17, p.263, 2002, (listed from 2005-2013)
Journal of Electronic Materials, 31, p.584, 2002, (listed from 2005-2013)
Soldering and Surface Mount Technology, 14, p.25, 2002, (listed from 2006.7-2009.9)
等5篇文章曾被ISI列為 "Highly Cited Papers"。
受邀擔任Discussion Leader, Gordon Research Conference on High Temperature Materials, Colby College, Maine, July 16-21, 2006.
中央大學93學年度學術研究傑出獎。
Best International Paper Award, The 2002 SMTA International Technical Conference, Chicago, IL, September 22-26, 2002.
中央大學工學院2001年研究優良教師。
Invited speaker on the opening day of the Gordon Research Conference on High Temperature Materials, Processes, and Diagnostics, Plymouth State College, NH, U.S.A., 2000.
Young Leaders Professional Development Award, The Minerals, Metals &Materials Society, 1999.
中央大學工學院1998年教學優良教師。
Graduate Student Award, Materials Research Society, 1992.